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SMAJP4KE550A-TP - MCC

Description: TVS

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SMAJP4KE550A-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMA-ren3
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3D Models
SMAJP4KE550A-TP - MCC  - 3D model - Diodes Moulded - SMA-ren3
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SMAJP4KE550A-TP Details

  • Manufacturer Part Number:

    SMAJP4KE550A-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AC

  • Package Description:

    SMAJ, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.48

  • Breakdown Voltage-Max:

    577.5 V

  • Breakdown Voltage-Min:

    522.5 V

  • Breakdown Voltage-Nom:

    550 V

  • Clamping Voltage-Max:

    760 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    400 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    495 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

SMAJP4KE550A-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for SMAJP4KE550A-TP is a rectangular pad with a size of 2.5mm x 1.5mm, with a solder mask clearance of 0.5mm around the pad.
  • Yes, SMAJP4KE550A-TP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the device is properly derated to prevent thermal runaway.
  • To prevent damage during soldering, it's recommended to use a soldering iron with a temperature of 250°C or less, and to avoid applying excessive force or pressure to the device. Additionally, ensure that the soldering time is kept to a minimum (less than 3 seconds).
  • Yes, SMAJP4KE550A-TP is compatible with lead-free soldering processes. However, it's essential to follow the recommended soldering profile and ensure that the soldering temperature does not exceed 260°C.
  • The typical response time of SMAJP4KE550A-TP to an ESD event is less than 1 nanosecond. This fast response time helps to protect sensitive electronic components from ESD damage.

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SMAJP4KE550A-TP Overview

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