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SMBJ28CA/TR13 - Yageo Group

Description: ESD Protection Diodes / TVS Diodes BID Wkg28V 1CH SMD DO214AA2 Bkdn31.1V

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PCB Footprints
SMBJ28CA/TR13 - Yageo Group PCB footprint - Other - Other - DO-214AA, SMB
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3D Models
SMBJ28CA/TR13 - Yageo Group  - 3D model - Other - DO-214AA, SMB
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SMBJ28CA/TR13 Details

  • Manufacturer Part Number:

    SMBJ28CA/TR13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMB, 2 PIN

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Date Of Intro:

    2019-04-29

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    7.16

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, PRSM-MIN, UL CERTIFIED

  • Breakdown Voltage-Max:

    34.4 V

  • Breakdown Voltage-Min:

    31.1 V

  • Breakdown Voltage-Nom:

    32.75 V

  • Clamping Voltage-Max:

    45.4 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    5 W

  • Reference Standard:

    UL CERTIFIED

  • Rep Pk Reverse Voltage-Max:

    28 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

SMBJ28CA/TR13 Frequently Asked Questions (FAQs)

  • The recommended land pattern for SMBJ28CA/TR13 is a rectangular pad with a size of 1.5mm x 0.8mm, with a solder mask clearance of 0.1mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • The thermal pad of SMBJ28CA/TR13 should be connected to a copper plane on the PCB to improve heat dissipation. A thermal via array can be used to connect the thermal pad to the copper plane. The via array should be designed to minimize thermal resistance and ensure good heat transfer.
  • The maximum operating temperature range for SMBJ28CA/TR13 is -40°C to 150°C. However, the device can withstand a maximum junction temperature of 175°C for a short period of time (typically 30 seconds) during soldering.
  • To ensure the reliability of SMBJ28CA/TR13 in high-reliability applications, it is recommended to follow the manufacturer's recommended storage and handling procedures, use a robust PCB design and layout, and implement a thorough testing and inspection process during manufacturing.
  • Yes, SMBJ28CA/TR13 is qualified for use in automotive applications. It meets the requirements of AEC-Q200, which is a standard for automotive-grade components. However, it is recommended to consult with the manufacturer and perform additional testing to ensure that the device meets the specific requirements of the application.

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SMBJ28CA/TR13 Overview

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