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SMBJ30A-TP - MCC

Description: TVS

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Symbol
SMBJ30A-TP - MCC - PCB symbol
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PCB Footprints
SMBJ30A-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMB (DO-214AA) (LEAD FRAME)
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3D Models
SMBJ30A-TP - MCC - 3D model - Diodes Moulded - SMB (DO-214AA) (LEAD FRAME)
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SMBJ30A-TP Details

  • Manufacturer Part Number:

    SMBJ30A-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Package Description:

    2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7

  • Breakdown Voltage-Max:

    36.8 V

  • Breakdown Voltage-Min:

    33.3 V

  • Breakdown Voltage-Nom:

    35.05 V

  • Clamping Voltage-Max:

    48.4 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    5 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

SMBJ30A-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the SMBJ30A-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It's essential to follow the recommended footprint to ensure proper soldering and thermal performance.
  • To ensure proper soldering, follow the recommended soldering profile and temperature range specified in the datasheet. Use a solder with a melting point below 240°C to prevent thermal damage. Inspect the solder joints for defects, such as cold joints, bridges, or excessive solder.
  • The SMBJ30A-TP is rated for operation from -65°C to 150°C. However, the device's performance and reliability may degrade if operated at extreme temperatures for extended periods. Ensure the device is operated within the recommended temperature range for optimal performance.
  • The SMBJ30A-TP is designed for transient voltage suppression and is not optimized for high-frequency applications. While it can be used in high-frequency circuits, its performance may degrade due to parasitic capacitance and inductance. Consider using a TVS diode specifically designed for high-frequency applications.
  • Select the correct SMBJ30A-TP variant based on the required standoff voltage, peak pulse current, and package type. Consider the specific requirements of your application, such as the maximum expected surge voltage, and choose the variant that meets those requirements.

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SMBJ30A-TP Overview

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For a full list of alternate parts for SMBJ30A-TP, check out Findchips.com