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SMBJ33A-TP - MCC

Description: • For Surface Mount Applicationsin Order to Optimize Board Space • Low Inductance • Fast Response Time: Typical Less than 1ps From 0V to VBR min • Halogen Free. “Green” Device (Note 1) • Moisture Sensitivity Level 1 • Epoxy Meets UL 94 V-0 Flammability Rating • Lead Free Finish/RoHS Compliant (Note 2) ("P" Suffix Designates RoHS Compliant. See Ordering Information) • For Bidirectional Devices Add “C” To The Suffix of The Part Number: i.e.SMBJ5.0CA for 5% Tolerance

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PCB Footprints
SMBJ33A-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMB (DO-214AA)  (LEAD FRAME)
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3D Models
SMBJ33A-TP - MCC  - 3D model - Diodes Moulded - SMB (DO-214AA)  (LEAD FRAME)
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SMBJ33A-TP Details

  • Manufacturer Part Number:

    SMBJ33A-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Package Description:

    2 PIN

  • Pin Count:

    2

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Breakdown Voltage-Max:

    40.6 V

  • Breakdown Voltage-Min:

    36.7 V

  • Breakdown Voltage-Nom:

    38.65 V

  • Clamping Voltage-Max:

    53.3 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    5 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    33 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

SMBJ33A-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the SMBJ33A-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It's essential to follow the recommended footprint to ensure proper soldering and to prevent thermal issues.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C. Apply a small amount of solder paste to the pads, and use a reflow oven or a hot air gun to solder the component. Avoid overheating, as it can damage the component.
  • The SMBJ33A-TP can operate safely between -55°C to 150°C. However, it's recommended to derate the component's power handling capabilities at higher temperatures to ensure reliability and prevent thermal runaway.
  • While the SMBJ33A-TP is a high-quality component, it may not meet the specific requirements for high-reliability or aerospace applications. It's essential to consult with the manufacturer and review the component's qualification and testing data to ensure it meets the specific requirements of your application.
  • Handle the SMBJ33A-TP in an ESD-controlled environment, wearing an ESD strap or wrist strap. Store the components in their original packaging or in an ESD-safe container to prevent damage. Avoid touching the component's pins or leads to prevent ESD damage.

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SMBJ33A-TP Overview

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Part Image SMBJ33-T Micro Commercial Components

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For a full list of alternate parts for SMBJ33A-TP, check out Findchips.com