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SMBJ33CAHE3-TP - MCC

Description: • AEC-Q101 Qualified • For Surface Mount Applications • Excellent Clamping Capability • Fast Response Time:Typical Less Than 1ps From 0V to VBR min • High Temp Soldering:260°C / 10 Seconds at Terminals • Halogen Free. “Green” Device (Note 1) • Moisture Sensitivity Level 1 • Epoxy Meets UL 94 V-0 Flammability Rating • Lead Free Finish/RoHS Compliant (Note2) ("P" Suffix Designates RoHS Compliant. See Ordering Information)

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SMBJ33CAHE3-TP - MCC - PCB symbol
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PCB Footprints
SMBJ33CAHE3-TP - MCC PCB footprint - Diodes Moulded Non Polarised - Diodes Moulded Non Polarised - SMB (DO-214AA) (LEAD FRAME)
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3D Models
SMBJ33CAHE3-TP - MCC - 3D model - Diodes Moulded Non Polarised - SMB (DO-214AA) (LEAD FRAME)
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SMBJ33CAHE3-TP Details

  • Manufacturer Part Number:

    SMBJ33CAHE3-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMB, 2 PIN

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Additional Feature:

    UL RECOGNIZED

  • Breakdown Voltage-Max:

    40.6 V

  • Breakdown Voltage-Min:

    36.7 V

  • Breakdown Voltage-Nom:

    38.65 V

  • Clamping Voltage-Max:

    53.3 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    5 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    33 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

SMBJ33CAHE3-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for SMBJ33CAHE3-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It is essential to follow the recommended footprint and land pattern to ensure proper soldering and to prevent thermal and mechanical stress on the component.
  • To prevent ESD damage, handle SMBJ33CAHE3-TP components with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the workspace and tools are grounded, and avoid touching the component's pins or body.
  • The maximum operating temperature range for SMBJ33CAHE3-TP is -55°C to 150°C. However, the component's performance and reliability may degrade if operated at extreme temperatures for an extended period.
  • SMBJ33CAHE3-TP is designed for low-frequency applications. While it can be used in high-frequency applications, its performance may degrade due to parasitic inductance and capacitance. It is recommended to consult with the manufacturer or a qualified engineer to determine the suitability of SMBJ33CAHE3-TP for high-frequency applications.
  • Solder SMBJ33CAHE3-TP using a soldering iron with a temperature range of 250°C to 260°C. Use a solder with a melting point of 180°C to 190°C, and ensure that the soldering time is less than 3 seconds. Avoid applying excessive heat or force, which can damage the component.

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SMBJ33CAHE3-TP Overview

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