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SMBJ5364B-TP - MCC

Description: Zener Diodes

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Symbol
SMBJ5364B-TP - MCC - PCB symbol
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PCB Footprints
SMBJ5364B-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMB (DO-214AA)
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3D Models
SMBJ5364B-TP - MCC - 3D model - Diodes Moulded - SMB (DO-214AA)
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SMBJ5364B-TP Details

  • Manufacturer Part Number:

    SMBJ5364B-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Package Description:

    2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    10 Ω

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    150 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    5 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    33 V

  • Reverse Current-Max:

    0.5 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    40 mA

SMBJ5364B-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for SMBJ5364B-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It's essential to follow the recommended footprint to ensure proper soldering and to prevent thermal and mechanical stress.
  • To ensure reliability in high-temperature applications, it's crucial to follow the recommended derating curves and thermal management guidelines provided in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature.
  • The maximum surge current rating for SMBJ5364B-TP is typically specified in the datasheet, but it's essential to note that this rating is based on a specific pulse duration and repetition rate. Be sure to consult the datasheet and application notes for specific guidance on surge current handling.
  • While it's technically possible to use SMBJ5364B-TP in a parallel configuration, it's not recommended due to potential mismatch and uneven current sharing between devices. Instead, consider using a single device with a higher current rating or exploring alternative solutions that can handle the required current.
  • The SMBJ5364B-TP has built-in ESD protection, but it's still essential to follow proper handling and assembly procedures to prevent ESD damage. Additionally, ensure that the device is properly soldered and that the PCB design includes adequate latch-up prevention measures, such as decoupling capacitors and series resistors.

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SMBJ5364B-TP Overview

Use the download button to access the SMBJ5364B-TP schematic symbol, PCB footprint, and 3D model.
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SMBJ5364B-TP Alternates

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For a full list of alternate parts for SMBJ5364B-TP, check out Findchips.com