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SMBJ5381B-TP - MCC

Description: Zener Diodes

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SMBJ5381B-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMBJ5381B-TP/
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SMBJ5381B-TP - MCC  - 3D model - Diodes Moulded - SMBJ5381B-TP/
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SMBJ5381B-TP Details

  • Manufacturer Part Number:

    SMBJ5381B-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    2 PIN

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    190 Ω

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    1250 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    5 W

  • Reference Voltage-Nom:

    130 V

  • Reverse Current-Max:

    0.5 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    10 mA

SMBJ5381B-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the SMBJ5381B-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It's essential to follow the recommended footprint to ensure proper soldering and to prevent thermal issues.
  • To ensure proper soldering, follow the recommended soldering profile and temperature range specified in the datasheet. Use a solder with a melting point below 220°C to prevent damage to the component. Inspect the solder joints for defects, such as cold solder joints, and rework them if necessary.
  • The maximum operating temperature range for the SMBJ5381B-TP is -55°C to 150°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range. It's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance.
  • Handle the SMBJ5381B-TP with anti-static wrist straps, mats, or gloves to prevent ESD damage. Store the devices in anti-static packaging or bags, and avoid touching the component's pins or leads. Follow the ESD handling and storage guidelines specified in the datasheet or industry standards.
  • The recommended power derating for the SMBJ5381B-TP depends on the operating temperature and other environmental factors. As a general guideline, derate the power by 1.5-2% per degree Celsius above 25°C. Consult the datasheet or application notes for specific derating guidelines.

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SMBJ5381B-TP Overview

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SMBJ5381B-TP Alternates

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Image Part Number Model
Part Image SMBJ5381BTR Microchip Technology Inc

Zener Diode, 130V V(Z), 5%, 5W, Silicon, Unidirectional, DO-214AA

Part Image MSPSMBJ5381B Microsemi Corporation (now Microchip)

Zener Diode, 130V V(Z), 5%, 1.38W, Silicon, Unidirectional, DO-214AA

Part Image SMBJ5381B-TP-HF Micro Commercial Components

Zener Diode, 130V V(Z), 5%, 5W, Silicon, Unidirectional, DO-214AA

Part Image MXSMBJ5381BE3TR Microsemi Corporation (now Microchip)

Zener Diode, 130V V(Z), 5%, 1.38W, Silicon, Unidirectional, DO-214AA

Part Image MQSMBJ5381B Microsemi Corporation (now Microchip)

Zener Diode, 130V V(Z), 5%, 1.38W, Silicon, Unidirectional, DO-214AA

For a full list of alternate parts for SMBJ5381B-TP, check out Findchips.com