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SMBJ6.5A-TP - MCC

Description: • For Surface Mount Applicationsin Order to Optimize Board Space • Low Inductance • Fast Response Time: Typical Less than 1ps From 0V to VBR min • Halogen Free. “Green” Device (Note 1) • Moisture Sensitivity Level 1 • Epoxy Meets UL 94 V-0 Flammability Rating • Lead Free Finish/RoHS Compliant (Note 2) ("P" Suffix Designates RoHS Compliant. See Ordering Information) • For Bidirectional Devices Add “C” To The Suffix of The Part Number: i.e.SMBJ5.0CA for 5% Tolerance

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Symbol
SMBJ6.5A-TP - MCC - PCB symbol
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PCB Footprints
SMBJ6.5A-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMB (DO-214AA) (LEAD FRAME)
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3D Models
SMBJ6.5A-TP - MCC - 3D model - Diodes Moulded - SMB (DO-214AA) (LEAD FRAME)
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SMBJ6.5A-TP Details

  • Manufacturer Part Number:

    SMBJ6.5A-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Package Description:

    2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7

  • Breakdown Voltage-Max:

    7.98 V

  • Breakdown Voltage-Min:

    7.22 V

  • Breakdown Voltage-Nom:

    7.6 V

  • Clamping Voltage-Max:

    11.2 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    5 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    6.5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

SMBJ6.5A-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for SMBJ6.5A-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It is essential to follow the recommended footprint to ensure proper soldering and to prevent thermal issues.
  • To ensure the reliability of SMBJ6.5A-TP in high-temperature applications, it is crucial to follow the derating curve provided in the datasheet. Additionally, consider using a heat sink or a thermal interface material to reduce the junction temperature. It is also essential to ensure that the device is operated within the recommended maximum junction temperature (Tj) of 150°C.
  • The maximum surge current that SMBJ6.5A-TP can handle is 65A for a 10/1000μs waveform, as specified in the datasheet. However, it is essential to note that the device may not be able to handle repeated surges, and the surge capability may degrade over time.
  • Yes, you can use SMBJ6.5A-TP in a parallel configuration to increase the surge current capability. However, it is essential to ensure that the devices are properly matched and that the current sharing is even. Additionally, consider the thermal implications of paralleling devices and ensure that the heat dissipation is adequate.
  • The typical response time of SMBJ6.5A-TP to an ESD event is in the range of picoseconds. The device is designed to respond quickly to ESD events to protect the downstream circuitry.

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SMBJ6.5A-TP Overview

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