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SMBJ8.0CA-Q - Bourns

Description: SMBJ-Q Transient Voltage Suppressor Diode Series, Bi-Directional

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PCB Footprints
SMBJ8.0CA-Q - Bourns PCB footprint - Diodes Moulded Non Polarised - Diodes Moulded Non Polarised - SMB(DO-214AA)
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3D Models
SMBJ8.0CA-Q - Bourns  - 3D model - Diodes Moulded Non Polarised - SMB(DO-214AA)
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SMBJ8.0CA-Q Details

  • Manufacturer Part Number:

    SMBJ8.0CA-Q

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMB, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.21

  • Additional Feature:

    PRSM-MIN

  • Breakdown Voltage-Max:

    9.83 V

  • Breakdown Voltage-Min:

    8.89 V

  • Breakdown Voltage-Nom:

    9.36 V

  • Clamping Voltage-Max:

    13.6 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    8 V

  • Reverse Current-Max:

    50 µA

  • Reverse Test Voltage:

    8 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMBJ8.0CA-Q Frequently Asked Questions (FAQs)

  • The recommended land pattern for SMBJ8.0CA-Q is a rectangular pad with a minimum size of 1.5 mm x 0.8 mm, with a 0.3 mm x 0.3 mm thermal pad in the center. The pad should be solder-mask defined and have a non-solder-mask-defined (NSMD) pad for the thermal pad.
  • The thermal pad on the SMBJ8.0CA-Q should be connected to a copper plane on the PCB to dissipate heat. A thermal via or a thermal pad on the PCB can be used to connect the thermal pad on the device to the copper plane. The thermal pad should not be soldered to the PCB.
  • The maximum operating temperature of SMBJ8.0CA-Q is 150°C. However, the device can withstand a maximum junction temperature of 175°C for a short duration.
  • To select the correct SMBJ8.0CA-Q for your application, consider the following factors: voltage rating, current rating, power rating, and package type. Ensure that the device can handle the maximum voltage and current in your application, and that it meets the required power rating.
  • The typical response time of SMBJ8.0CA-Q is less than 1 ns. This means that the device can respond to overvoltage events in less than 1 nanosecond.

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SMBJ8.0CA-Q Overview

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