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SMBJP6KE200CA-TP - MCC

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PCB Footprints
SMBJP6KE200CA-TP - MCC PCB footprint - Diodes Moulded Non Polarised - Diodes Moulded Non Polarised - SMB
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3D Models
SMBJP6KE200CA-TP - MCC  - 3D model - Diodes Moulded Non Polarised - SMB
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SMBJP6KE200CA-TP Details

  • Manufacturer Part Number:

    SMBJP6KE200CA-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    210 V

  • Breakdown Voltage-Min:

    190 V

  • Breakdown Voltage-Nom:

    200 V

  • Clamping Voltage-Max:

    274 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    171 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

SMBJP6KE200CA-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for SMBJP6KE200CA-TP is a rectangular pad with a size of 1.3mm x 0.8mm, with a solder mask clearance of 0.1mm. It's also recommended to have a thermal pad with a size of 2.5mm x 2.5mm.
  • Yes, SMBJP6KE200CA-TP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the device is properly derated to prevent thermal runaway.
  • To ensure the reliability of SMBJP6KE200CA-TP, it's crucial to follow proper PCB design guidelines, such as providing adequate heat sinking, using a suitable soldering process, and ensuring that the device is operated within its recommended specifications.
  • Yes, SMBJP6KE200CA-TP is compatible with lead-free soldering processes, such as SAC305. However, it's essential to follow the recommended soldering profile to prevent damage to the device.
  • The typical response time of SMBJP6KE200CA-TP is around 1-2 nanoseconds, making it suitable for high-speed applications.

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SMBJP6KE200CA-TP Overview

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