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SMBJP6KE33A-TP - MCC

Description: TVS

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Symbol
SMBJP6KE33A-TP - MCC - PCB symbol
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PCB Footprints
SMBJP6KE33A-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - smb
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3D Models
SMBJP6KE33A-TP - MCC - 3D model - Diodes Moulded - smb
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SMBJP6KE33A-TP Details

  • Manufacturer Part Number:

    SMBJP6KE33A-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    34.7 V

  • Breakdown Voltage-Min:

    31.4 V

  • Breakdown Voltage-Nom:

    33 V

  • Clamping Voltage-Max:

    45.7 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    28.2 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

SMBJP6KE33A-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the SMBJP6KE33A-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It is essential to follow the recommended footprint and land pattern to ensure reliable soldering and to prevent thermal and mechanical stress.
  • To handle the SMBJP6KE33A-TP for optimal reliability, it is recommended to follow proper handling and storage procedures, such as storing the components in a dry, cool place, away from direct sunlight and moisture. It is also essential to handle the components by the body, rather than the leads, to prevent damage and electrostatic discharge.
  • The maximum allowable voltage derating for the SMBJP6KE33A-TP is typically 10-15% below the maximum rated voltage. However, it is recommended to consult the datasheet or contact Micro Commercial Components for specific derating guidelines for the SMBJP6KE33A-TP.
  • The SMBJP6KE33A-TP is rated for operation up to 150°C. However, it is recommended to consult the datasheet or contact Micro Commercial Components for specific guidance on using the SMBJP6KE33A-TP in high-temperature applications, as the component's performance and reliability may be affected by extreme temperatures.
  • To ensure the SMBJP6KE33A-TP is properly soldered, it is recommended to follow proper soldering techniques, such as using a soldering iron with a temperature range of 200-250°C, and using a solder with a melting point of 180-190°C. It is also essential to ensure the component is properly aligned and seated on the PCB before soldering.

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SMBJP6KE33A-TP Overview

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