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SMBJP6KE51CA-TP - MCC

Description: TVS

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SMBJP6KE51CA-TP - MCC PCB footprint - Diodes Moulded Non Polarised - Diodes Moulded Non Polarised - SMB
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3D Models
SMBJP6KE51CA-TP - MCC  - 3D model - Diodes Moulded Non Polarised - SMB
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SMBJP6KE51CA-TP Details

  • Manufacturer Part Number:

    SMBJP6KE51CA-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    53.6 V

  • Breakdown Voltage-Min:

    48.5 V

  • Breakdown Voltage-Nom:

    51 V

  • Clamping Voltage-Max:

    70.1 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    43.6 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

SMBJP6KE51CA-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for SMBJP6KE51CA-TP is a rectangular pad with a size of 0.95mm x 0.95mm, with a solder mask clearance of 0.1mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • Yes, SMBJP6KE51CA-TP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at temperatures above 125°C, so careful consideration should be given to the specific application requirements.
  • ESD protection is critical when handling SMBJP6KE51CA-TP. It is recommended to use an ESD wrist strap or mat, and to handle the device by the body or pins, rather than the leads. Additionally, the device should be stored in an ESD-protective package or bag when not in use.
  • The recommended soldering profile for SMBJP6KE51CA-TP is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The device should be soldered using a solder with a melting point of 217°C or higher, and the soldering process should be done in a nitrogen atmosphere to minimize oxidation.
  • Yes, SMBJP6KE51CA-TP is AEC-Q101 qualified, making it suitable for use in automotive applications. However, the device's performance and reliability should be validated in the specific application environment, and the device should be used in accordance with the manufacturer's recommendations and industry standards.

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SMBJP6KE51CA-TP Overview

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