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SMBJP6KE56A-TP - MCC

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Symbol
SMBJP6KE56A-TP - MCC - PCB symbol
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PCB Footprints
SMBJP6KE56A-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - smb
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3D Models
SMBJP6KE56A-TP - MCC - 3D model - Diodes Moulded - smb
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SMBJP6KE56A-TP Details

  • Manufacturer Part Number:

    SMBJP6KE56A-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    58.8 V

  • Breakdown Voltage-Min:

    53.2 V

  • Breakdown Voltage-Nom:

    56 V

  • Clamping Voltage-Max:

    77 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    47.8 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

SMBJP6KE56A-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for SMBJP6KE56A-TP is a rectangular pad with a size of 0.95mm x 1.45mm, with a solder mask clearance of 0.15mm. It's recommended to follow the IPC-7351 standard for land pattern design.
  • While SMBJP6KE56A-TP is rated for operation up to 150°C, it's not recommended for use in high-temperature applications above 125°C without proper derating. Consult the manufacturer's application notes for guidance on high-temperature use.
  • To prevent ESD damage, handle SMBJP6KE56A-TP with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the workspace is ESD-protected and follow proper handling procedures.
  • The recommended soldering profile for SMBJP6KE56A-TP is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Ensure that the soldering process is within the manufacturer's recommended specifications to prevent damage.
  • While SMBJP6KE56A-TP meets the requirements for automotive applications, it's essential to verify that the specific device meets the required automotive standards, such as AEC-Q101. Consult the manufacturer's documentation and application notes for guidance.

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SMBJP6KE56A-TP Overview

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