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SMBSAC5.0-TP - MCC

Description: 10V Clamp 44A Ipp Tvs Diode Surface Mount DO-214AA (SMB)

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Symbol
SMBSAC5.0-TP - MCC - PCB symbol
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PCB Footprints
SMBSAC5.0-TP - MCC PCB footprint - Other - Other - SMB (DO-214AA) (LEAD FRAME)
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3D Models
SMBSAC5.0-TP - MCC - 3D model - Other - SMB (DO-214AA) (LEAD FRAME)
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SMBSAC5.0-TP Details

  • Manufacturer Part Number:

    SMBSAC5.0-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DO-214AA

  • Package Description:

    SMB, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    0

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Min:

    7.6 V

  • Breakdown Voltage-Nom:

    7.6 V

  • Clamping Voltage-Max:

    10 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    500 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

SMBSAC5.0-TP Frequently Asked Questions (FAQs)

  • A 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer is recommended. This helps to dissipate heat efficiently and reduce thermal resistance.
  • Use a secure mounting method, such as a screw or adhesive, to prevent the component from shifting or detaching during vibration. Additionally, consider using a vibration-dampening material, like a silicone adhesive, to reduce stress on the component.
  • The maximum allowable power derating is 50% at 125°C. This means that the component should not be operated above 50% of its maximum power rating at temperatures above 125°C to ensure reliable operation and prevent overheating.
  • Yes, but with precautions. The component is not hermetically sealed, so it's essential to apply a conformal coating to protect it from moisture. Additionally, ensure the PCB is designed with moisture-resistant materials and follow proper handling and storage procedures to minimize exposure to humidity.
  • A soldering profile with a peak temperature of 240°C to 250°C, a dwell time of 30-60 seconds, and a cooling rate of 4°C/s to 6°C/s is recommended. This helps prevent thermal shock and ensures reliable solder joints.

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SMBSAC5.0-TP Overview

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