SMBT2907AE6327HTSA1 footprint, schematic symbol and 3D model by Infineon

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Datasheet Download Datasheet
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Part Number SMBT2907AE6327HTSA1
Manufacturer Infineon
Pin Count 3
Part Category Transistor BJT PNP
Package Category SOT23 (3-Pin)
Footprint Name SOT23 (3-Pin) - SOT23 1
Released Date Apr 14, 2020
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

SMBT2907AE6327HTSA1 Details

Manufacturer Part Number:
SMBT2907AE6327HTSA1
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
End Of Life
Country Of Origin:
Austria, Mainland China
ECCN Code:
EAR99
Manufacturer:
Infineon Technologies AG
YTEOL:
1
Collector Current-Max (IC):
0.6 A
Collector-Emitter Voltage-Max:
60 V
Configuration:
SINGLE
DC Current Gain-Min (hFE):
50
JESD-30 Code:
R-PDSO-G3
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
3
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Polarity/Channel Type:
PNP
Power Dissipation-Max (Abs):
0.33 W
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
Tin (Sn)
Terminal Form:
GULL WING
Terminal Position:
DUAL
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
Transition Frequency-Nom (fT):
200 MHz
Turn-off Time-Max (toff):
110 ns
Turn-on Time-Max (ton):
50 ns

SMBT2907AE6327HTSA1 Frequently Asked Questions (FAQs)

Infineon recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended PCB layout guidelines. Also, consider using a thermocouple to monitor the device temperature.
The maximum allowed voltage on the gate driver output is 15V, as specified in the datasheet. Exceeding this voltage may damage the device.
Yes, the SMBT2907AE6327HTSA1 is qualified according to AEC-Q101, making it suitable for high-reliability applications such as automotive systems.
Use a logic analyzer or oscilloscope to monitor the device's input and output signals. Check the device's thermal performance, power supply, and PCB layout for any potential issues.

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