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SMC30J6.5A - STMicroelectronics

Description: 3000 W, 6.5 V TVS in SMC

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SMC30J6.5A - STMicroelectronics PCB footprint - Diodes Moulded - Diodes Moulded - smc
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SMC30J6.5A - STMicroelectronics  - 3D model - Diodes Moulded - smc
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SMC30J6.5A Details

  • Manufacturer Part Number:

    SMC30J6.5A

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SMC, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Breakdown Voltage-Max:

    7.9 V

  • Breakdown Voltage-Min:

    7.2 V

  • Breakdown Voltage-Nom:

    7.58 V

  • Clamping Voltage-Max:

    11.2 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • Non-rep Peak Rev Power Dis-Max:

    3000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-4, 4-5; MIL-STD-750

  • Rep Pk Reverse Voltage-Max:

    6.5 V

  • Reverse Current-Max:

    20 µA

  • Reverse Test Voltage:

    6.5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

SMC30J6.5A Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad on the bottom of the package connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliability, it's essential to follow the recommended operating temperature range (-40°C to 150°C) and avoid exceeding the maximum junction temperature (Tj) of 150°C. Additionally, ensure proper thermal design, use a suitable thermal interface material, and follow the recommended soldering profile to minimize thermal stress.
  • STMicroelectronics recommends using a human-body model (HBM) ESD protection of at least 2 kV and a machine model (MM) ESD protection of at least 200 V to prevent damage to the device. Additionally, use ESD-sensitive handling and storage procedures to prevent damage during manufacturing and assembly.
  • Yes, the SMC30J6.5A is suitable for high-frequency switching applications up to 100 kHz. However, it's essential to consider the device's switching characteristics, such as rise and fall times, and ensure that the application's switching frequency does not exceed the device's maximum rating.
  • To troubleshoot issues, start by verifying the device's pinout and connections. Check for proper power supply, ground, and signal connections. Use oscilloscopes and logic analyzers to monitor the device's input and output signals. Consult the datasheet and application notes for guidance on troubleshooting common issues, such as overvoltage, undervoltage, and overheating.

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SMC30J6.5A Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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