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SMD1150PLHE3-TP - MCC

Description: Schottky Barrier Rectifiers

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SMD1150PLHE3-TP - MCC - PCB symbol
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SMD1150PLHE3-TP - MCC PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-123FL 1cdd
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SMD1150PLHE3-TP - MCC - 3D model - Small Outline Diode Flat Lead - SOD-123FL 1cdd
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SMD1150PLHE3-TP Details

  • Manufacturer Part Number:

    SMD1150PLHE3-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    150 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.85 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    150 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    150 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

SMD1150PLHE3-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SMD1150PLHE3-TP can be found in the Micro Commercial Components' application note AN-113, which provides detailed guidelines for PCB layout and assembly.
  • The thermal pad on the SMD1150PLHE3-TP should be connected to a solid ground plane on the PCB to ensure proper heat dissipation. A thermal via or a thermal pad on the PCB is recommended to improve thermal performance.
  • The maximum operating temperature range for the SMD1150PLHE3-TP is -55°C to +150°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of -40°C to +125°C for optimal performance and reliability.
  • The SMD1150PLHE3-TP is designed to withstand moderate vibration levels. However, for high-vibration environments, it's recommended to use additional mechanical support or potting to ensure the device remains securely attached to the PCB.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the datasheet. Additionally, use a solder with a melting point above 217°C to prevent damage to the device.

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SMD1150PLHE3-TP Overview

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