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SMD23PE-TP - MCC

Description: Diode 30 V 2A Surface Mount SOD-323HE

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Symbol
SMD23PE-TP - MCC - PCB symbol
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PCB Footprints
SMD23PE-TP - MCC PCB footprint - Other - Other - SMD23PE-TP
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3D Models
SMD23PE-TP - MCC - 3D model - Other - SMD23PE-TP
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SMD23PE-TP Details

  • Manufacturer Part Number:

    SMD23PE-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-323HE, 2 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.1

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.6 V

  • JESD-30 Code:

    R-PDSO-F2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    50 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

SMD23PE-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for SMD23PE-TP is a rectangular pad with a size of 1.3mm x 0.8mm, with a solder mask clearance of 0.1mm. It's also recommended to have a thermal pad with a size of 2.5mm x 2.5mm.
  • The thermal pad of SMD23PE-TP should be connected to a copper plane on the PCB to dissipate heat efficiently. It's recommended to use a thermal relief pattern to connect the thermal pad to the copper plane to prevent excessive heat buildup.
  • The maximum operating temperature range for SMD23PE-TP is -55°C to 150°C. However, the device's performance may degrade at extreme temperatures, and it's recommended to operate it within the recommended temperature range of -40°C to 125°C for optimal performance.
  • To ensure reliable soldering of SMD23PE-TP, it's recommended to use a soldering iron with a temperature range of 220°C to 250°C, and to use a solder paste with a melting point of 180°C to 220°C. It's also important to follow the recommended soldering profile and to avoid overheating the device.
  • The moisture sensitivity level (MSL) of SMD23PE-TP is MSL 3, which means that the device can be exposed to a maximum of 168 hours of humidity at 30°C and 60% relative humidity before soldering.

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SMD23PE-TP Overview

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