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SMDA12C-5.TBT - SEMTECH

Description: ESD Protection Diodes / TVS Diodes 12V, 5 CHAN, TVS ARRAY

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PCB Footprints
SMDA12C-5.TBT - SEMTECH PCB footprint - Small Outline Packages - Small Outline Packages - SO-8
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SMDA12C-5.TBT - SEMTECH  - 3D model - Small Outline Packages - SO-8
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SMDA12C-5.TBT Details

  • Manufacturer Part Number:

    SMDA12C-5.TBT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, SOIC-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Semtech Corporation

  • YTEOL:

    3

  • Additional Feature:

    HIGH RELIABILITY, LOW LEAKAGE CURRENT

  • Breakdown Voltage-Min:

    16.7 V

  • Breakdown Voltage-Nom:

    16.7 V

  • Clamping Voltage-Max:

    19 V

  • Configuration:

    COMMON CATHODE, 6 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    MS-012AA

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    300 W

  • Number of Elements:

    6

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    12 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

SMDA12C-5.TBT Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a 50-ohm microstrip transmission line for the RF output.
  • Use a thermal pad or a heat sink to dissipate heat. Ensure good airflow around the device. Avoid operating the device in extreme temperatures (above 85°C or below -40°C) for extended periods.
  • The recommended input power level is between -20 dBm and 0 dBm. Exceeding this range may cause compression or distortion.
  • Use a low-power mode (e.g., standby mode) when not transmitting. Reduce the supply voltage to the minimum required for the application. Use a power-saving mode or shutdown the device when not in use.
  • Use a human-body model (HBM) ESD protection diode (e.g., 1.5 kV) on the input and output pins. Ensure the PCB layout and assembly process minimize ESD risks.

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SMDA12C-5.TBT Overview

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