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SMDA12C.TBT - SEMTECH

Description: Semtech SMDA12C.TBT, Quad-Element Bi-Directional TVS Diode Array, 300W, 8-Pin SOIC

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PCB Footprints
SMDA12C.TBT - SEMTECH PCB footprint - Small Outline Packages - Small Outline Packages - SO-8
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SMDA12C.TBT - SEMTECH  - 3D model - Small Outline Packages - SO-8
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SMDA12C.TBT Details

  • Manufacturer Part Number:

    SMDA12C.TBT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    LEAD FREE, SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Semtech Corporation

  • YTEOL:

    6.41

  • Additional Feature:

    HIGH RELIABILITY, LOW LEAKAGE CURRENT

  • Breakdown Voltage-Min:

    13.3 V

  • Clamping Voltage-Max:

    19 V

  • Configuration:

    COMMON BIPOLAR TERMINAL, 8 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    MS-012AA

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    300 W

  • Number of Elements:

    8

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    12 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMDA12C.TBT Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a 50-ohm microstrip or coplanar waveguide for the RF traces.
  • Ensure good thermal conductivity by using a thermal pad or thermal tape to attach the device to a heat sink or a metal core PCB. Avoid overheating by keeping the device away from heat sources and ensuring good airflow.
  • Power up the device in the following sequence: VCC, then VDD, and finally the enable pin (EN). This ensures proper initialization and prevents damage to the device.
  • Use a logic analyzer or oscilloscope to monitor the device's signals. Check the power supply voltage, clock signal, and data transmission. Verify the device is properly configured and the firmware is up-to-date.
  • Yes, but it may require custom firmware development and testing. Ensure the device is operated within its specified parameters and that the custom protocol does not exceed the device's capabilities.

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SMDA12C.TBT Overview

Use the download button to access the SMDA12C.TBT schematic symbol, PCB footprint, and 3D model.
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Part Image SMDA12C.TB Semtech Corporation

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Part Image SMDA12C-7 Semtech Corporation

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For a full list of alternate parts for SMDA12C.TBT, check out Findchips.com