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SMDA12Ce3/TR7 - Microsemi Corporation

Description: ESD Suppressors / TVS Diodes Diode Array

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SMDA12Ce3/TR7 - Microsemi Corporation - PCB symbol
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SMDA12Ce3/TR7 - Microsemi Corporation PCB footprint - Small Outline Packages - Small Outline Packages - 8-SO_
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SMDA12Ce3/TR7 - Microsemi Corporation - 3D model - Small Outline Packages - 8-SO_
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SMDA12Ce3/TR7 Details

  • Manufacturer Part Number:

    SMDA12CE3/TR7

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, PLASTIC, SOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Breakdown Voltage-Min:

    13.3 V

  • Configuration:

    SEPARATE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Non-rep Peak Rev Power Dis-Max:

    300 W

  • Number of Elements:

    4

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Rep Pk Reverse Voltage-Max:

    12 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMDA12Ce3/TR7 Frequently Asked Questions (FAQs)

  • The recommended land pattern for SMDA12CE3/TR7 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1 mm.
  • To handle thermal management, ensure good thermal conductivity between the device and the PCB by using a thermal via or a thermal pad. The thermal pad should be connected to a large copper area on the PCB to dissipate heat efficiently.
  • The maximum operating temperature range for SMDA12CE3/TR7 is -55°C to 150°C. However, the device is typically specified for operation from -40°C to 125°C.
  • Yes, SMDA12CE3/TR7 is designed for high-reliability and high-temperature applications. It is qualified to the MIL-PRF-19500 standard and is suitable for use in aerospace, defense, and other high-reliability industries.
  • To ensure reliability in a radiation-intensive environment, follow the guidelines for radiation hardness assurance (RHA) and total ionizing dose (TID) testing. The device is designed to withstand radiation exposure up to 100 krad(Si) and is suitable for use in space and other radiation-intensive applications.

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SMDA12Ce3/TR7 Overview

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