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SMF14AT1G - onsemi

Description: 200 W Transient Voltage Suppressor SOD-123 Flat Lead Package

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PCB Footprints
SMF14AT1G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-123FL CASE498
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3D Models
SMF14AT1G - onsemi  - 3D model - Small Outline Diode Flat Lead - SOD-123FL CASE498
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SMF14AT1G Details

  • Manufacturer Part Number:

    SMF14AT1G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    SOD

  • Package Description:

    ROHS COMPLIANT, PLASTIC, CASE 498, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    498-01

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, LOW ZENER IMPEDANCE

  • Breakdown Voltage-Max:

    17.2 V

  • Breakdown Voltage-Min:

    15.6 V

  • Breakdown Voltage-Nom:

    16.4 V

  • Clamping Voltage-Max:

    23.2 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    1000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.385 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    14 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMF14AT1G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SMF14AT1G is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a 0.5 mm diameter hole in the center for the thermal pad.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Avoid applying excessive heat or pressure, which can damage the device.
  • The maximum operating temperature range for the SMF14AT1G is -40°C to 150°C, with a junction temperature (Tj) of up to 150°C.
  • Store the SMF14AT1G in a dry, cool place, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the device by the body, not the leads.
  • The recommended reflow soldering profile for the SMF14AT1G is a peak temperature of 240°C to 250°C, with a dwell time of 30 seconds to 60 seconds above 217°C.

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SMF14AT1G Overview

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For a full list of alternate parts for SMF14AT1G, check out Findchips.com