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SMF15CT1G - onsemi

Description: Protects up to 5 Lines in a Single SC-88 Package; Peak Power Dissipation - 100W (8x20 µ Waveform); ESD Rating of Class 3B (Exceeding 8 kV) per Human Body Model and Class C (Exceeding 400 V) per Machine Model; Compliance with IEC 61000-4-2 (ESD) 15 kV (Air), 8 kV (Contact); UL Flammability Rating of 94V-0; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

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PCB Footprints
SMF15CT1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC-88 (SC-70 6 LEAD)
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3D Models
SMF15CT1G - onsemi  - 3D model - SOT23 (6-Pin) - SC-88 (SC-70 6 LEAD)
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SMF15CT1G Details

  • Manufacturer Part Number:

    SMF15CT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88/SC70-6/SOT-363 6 LEAD

  • Package Description:

    SC-88, SC-70, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    419B-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Breakdown Voltage-Max:

    19 V

  • Breakdown Voltage-Min:

    17 V

  • Breakdown Voltage-Nom:

    18 V

  • Clamping Voltage-Max:

    29 V

  • Configuration:

    COMMON ANODE, 5 ELEMENTS, 5 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    100 W

  • Number of Elements:

    5

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    15 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    15 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMF15CT1G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for SMF15CT1G is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a 0.5 mm radius corner. The pad should be centered on the component and have a solder mask defined (SMD) pad shape.
  • The thermal pad of SMF15CT1G should be connected to a copper plane on the PCB to improve thermal dissipation. A thermal via array can be used to connect the thermal pad to the copper plane. The thermal pad should not be connected to any signal or power net.
  • The maximum operating temperature range for SMF15CT1G is -40°C to 150°C. However, the device is only guaranteed to meet its electrical specifications within the range of -40°C to 125°C.
  • Yes, SMF15CT1G is suitable for high-reliability applications. It is manufactured using a high-reliability process and is screened to ensure that it meets the requirements of the automotive and industrial markets.
  • To ensure the reliability of SMF15CT1G in a humid environment, it is recommended to use a conformal coating or potting compound to protect the device from moisture. Additionally, the PCB should be designed to minimize the risk of moisture ingress.

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SMF15CT1G Overview

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