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SMF26AT1G - onsemi

Description: 200 W Transient Voltage Suppressor SOD-123 Flat Lead Package

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Symbol
SMF26AT1G - onsemi - PCB symbol
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PCB Footprints
SMF26AT1G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-123FL CASE498
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3D Models
SMF26AT1G - onsemi - 3D model - Small Outline Diode Flat Lead - SOD-123FL CASE498
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SMF26AT1G Details

  • Manufacturer Part Number:

    SMF26AT1G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    SOD

  • Package Description:

    ROHS COMPLIANT, PLASTIC, CASE 498, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    498-01

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, LOW ZENER IMPEDANCE

  • Breakdown Voltage-Max:

    44.2 V

  • Breakdown Voltage-Min:

    40 V

  • Breakdown Voltage-Nom:

    30.4 V

  • Clamping Voltage-Max:

    42.1 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    1000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.385 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    36 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMF26AT1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to improve heat dissipation.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the device when designing the system.
  • The device has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Additionally, consider adding external ESD protection devices if the system requires it.
  • Yes, the SMF26AT1G is AEC-Q101 qualified, making it suitable for automotive applications. However, it's essential to follow the recommended operating conditions and ensure that the device is used within its specified ratings.
  • Start by verifying the device's operating conditions, including voltage, current, and temperature. Check for any signs of physical damage or contamination. Use oscilloscopes and other diagnostic tools to identify the root cause of the issue.

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SMF26AT1G Overview

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