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SMF4L13A - LITTELFUSE

Description: ESD Suppressors / TVS Diodes 400W 13V 5% Uni-directional

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PCB Footprints
SMF4L13A - LITTELFUSE PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - LTC4370IMS#PBF
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3D Models
SMF4L13A - LITTELFUSE  - 3D model - Small Outline Diode Flat Lead - LTC4370IMS#PBF
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SMF4L13A Details

  • Manufacturer Part Number:

    SMF4L13A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Date Of Intro:

    2016-03-03

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    7.6

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    15.9 V

  • Breakdown Voltage-Min:

    14.4 V

  • Breakdown Voltage-Nom:

    15.15 V

  • Clamping Voltage-Max:

    21.5 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    2000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1 W

  • Reference Standard:

    IEC-61000-4-2, 4-4; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    13 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    13 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMF4L13A Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for SMF4L13A is a rectangular pad with a minimum size of 2.5mm x 1.5mm, with a 0.5mm radius corner and a 0.3mm spacing between pads.
  • To ensure reliable soldering of SMF4L13A, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Avoid applying excessive heat or pressure, which can damage the component.
  • SMF4L13A is rated for operation up to 150°C, but it's not recommended to use it in environments above 125°C for extended periods. Prolonged exposure to high temperatures can affect the component's reliability and lifespan.
  • To prevent electrostatic discharge (ESD) damage, handle SMF4L13A components with an anti-static wrist strap or mat, and ensure that the workspace is ESD-protected. Avoid touching the component's pins or leads with bare hands.
  • SMF4L13A is designed to withstand moderate vibration, but it's not recommended for use in extremely high-vibration environments. If you expect high vibration, consider using a more robust component or adding additional mechanical support.

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SMF4L13A Overview

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