The recommended PCB footprint for SMF4L5.0AT1G is a rectangular pad with dimensions of 1.2mm x 0.8mm, with a 0.5mm radius corner. The pad should be centered on the component and have a solder mask defined (SMD) pad.
While the SMF4L5.0AT1G is rated for operation up to 150°C, it's essential to consider the derating curve and ensure the device doesn't exceed its maximum junction temperature (Tj) of 150°C. Consult the datasheet and application notes for guidance on high-temperature operation.
To ensure proper soldering, follow the recommended soldering profile: peak temperature of 260°C, time above 217°C of 30 seconds, and a soldering iron temperature of 350°C. Use a solder with a melting point above 217°C, and avoid applying excessive force or vibration during the soldering process.
The SMF4L5.0AT1G has a maximum surge current rating of 100A for 10/1000μs, as per the IEC 61000-4-5 standard. This rating is based on the device's ability to withstand high-current surges without damage or degradation.
Yes, SMF4L5.0AT1G can be used in a parallel configuration to increase the overall current rating. However, it's crucial to ensure that the devices are properly matched, and the PCB layout is designed to minimize current imbalance and thermal mismatch between the devices.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
SMF4L5.0AT1G Overview
Use the download button to access the SMF4L5.0AT1G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SMF4L,
or try a keyword search, such as Transient Suppressors
