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SMF530KJT - TE Connectivity

Description: Configuration Features: Number of Resistors 1 | Dimensions: Product Height .268 INCH | Product Width 7.3 MM | Product Width .287 INCH | Product Length 13.5 MM | Product Height 6.8 MM | Product Length .531 INCH | Electrical Characteristics: Resistance Class 1kΩ – 1MΩ | Operating Voltage 500 V | Power Rating 5 WATT | Passive Component Tolerance 5 PCT | Resistance Value 30K OHM | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Resistor Type Power Resistor | Element Type Metal F

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PCB Footprints
SMF530KJT - TE Connectivity PCB footprint - Resistor Moulded - Resistor Moulded - SM_5
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SMF530KJT - TE Connectivity  - 3D model - Resistor Moulded - SM_5
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SMF530KJT Details

  • Manufacturer Part Number:

    SMF530KJT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    23 Weeks, 4 Days

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    8

  • Additional Feature:

    FLAME PROOF

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    275 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    6.8 mm

  • Package Length:

    13.5 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    7.3 mm

  • Packing Method:

    TR

  • Physical Dimension:

    7.3mm x 13.5mm

  • Rated Power Dissipation (P):

    5 W

  • Rated Temperature:

    20 °C

  • Resistance:

    30000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    5329

  • Surface Mount:

    YES

  • Technology:

    METAL FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    500 V

SMF530KJT Frequently Asked Questions (FAQs)

  • TE Connectivity provides a recommended PCB layout and land pattern in their application note AN-1043, which can be found on their website. It's essential to follow these guidelines to ensure proper soldering and to prevent thermal and mechanical stress on the component.
  • To prevent damage, handle the SMF530KJT by the body only, avoiding touching the leads or the thermal pad. Use ESD-safe materials and tools, and follow proper rework procedures to prevent overheating or mechanical stress. TE Connectivity also recommends using a thermal interface material (TIM) to ensure good thermal contact between the component and the PCB.
  • The maximum allowable thermal resistance for the SMF530KJT is not explicitly stated in the datasheet. However, TE Connectivity recommends a thermal resistance of ≤ 1.5°C/W for optimal performance. It's essential to ensure good thermal contact between the component and the PCB to maintain a low thermal resistance.
  • The SMF530KJT is designed to withstand moderate vibration and shock. However, for high-vibration or high-shock applications, TE Connectivity recommends using additional mechanical support or potting the component to ensure its reliability. It's essential to consult with TE Connectivity's application engineers to determine the suitability of the component for specific use cases.
  • TE Connectivity recommends using a thermal interface material (TIM) with a thermal conductivity of ≥ 1.5 W/m-K and a thickness of ≤ 0.5 mm. The choice of TIM depends on the specific application, operating temperature, and environmental conditions. Consult with TE Connectivity's application engineers or refer to their application notes for guidance on selecting the correct TIM.

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SMF530KJT Overview

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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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