Bivar recommends a PCB layout with a solid ground plane and thermal vias under the device to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
Bivar recommends using a soldering temperature of 260°C (500°F) with a dwell time of 3-5 seconds. A solder with a melting point of 180-190°C (356-374°F) is recommended.
The maximum allowable voltage drop across the SMFLP24.0 is 2.5V. Exceeding this voltage drop may lead to reduced performance and reliability.
Yes, the SMFLP24.0 is designed to operate in humid environments. However, it's recommended to follow proper conformal coating and sealing procedures to ensure reliability.
Bivar recommends storing the SMFLP24.0 in a dry, cool place with a temperature range of 20°C to 30°C (68°F to 86°F) and humidity below 60%.
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SMFLP24.0 Overview
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