CUI Inc recommends a PCB layout with a solid ground plane and thermal vias to dissipate heat. A minimum of 1 oz copper thickness is recommended. Additionally, a thermal pad on the bottom of the module can be used to improve heat dissipation.
Yes, the SMI18-9-V-P5 is designed to withstand vibrations up to 10G peak acceleration. However, it's recommended to follow proper mounting and screw torque guidelines to ensure reliable operation.
The SMI18-9-V-P5 can tolerate input voltage deviations of up to ±10% of the nominal input voltage without affecting performance or reliability.
CUI Inc recommends following proper EMC design guidelines, including using a metal enclosure, proper cable shielding, and filtering to minimize electromagnetic interference (EMI).
The SMI18-9-V-P5 has a typical efficiency of 85% at 25% load, 88% at 50% load, and 90% at 75% load. Efficiency may vary depending on the specific application and operating conditions.
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SMI18-9-V-P5 Overview
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