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SML-H10PD2BT86 - ROHM Semiconductor

Description: Photodiodes Short-wavelength Infrared (SWIR) Surface Mount Photo Diodes: Short-wavelength Infrared (SWIR) Surface Mount Photo Diodes featuringInGaAs packed with black epoxy resin.

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SML-H10PD2BT86 - ROHM Semiconductor PCB footprint - Other - Other - SML-H10PD2BT86-1
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3D Models
SML-H10PD2BT86 - ROHM Semiconductor  - 3D model - Other - SML-H10PD2BT86-1
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SML-H10PD2BT86 Details

  • Manufacturer Part Number:

    SML-H10PD2BT86

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • HTS Code:

    8541.41.00.00

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    10

  • Configuration:

    SINGLE

  • Dark Current-Max:

    0.8 nA

  • Infrared Range:

    YES

  • Light Current-Nom:

    0.00031 mA

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Optoelectronic Device Type:

    PN PHOTODIODE

  • Packing Method:

    TR, 7 INCH

  • Peak Wavelength:

    1550 nm

  • Reverse Voltage-Max:

    5 V

  • Semiconductor Material:

    InGaAs

  • Shape:

    RECTANGULAR

  • Surface Mount:

    YES

SML-H10PD2BT86 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the SML-H10PD2BT86 is -40°C to 85°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade if operated outside this range for extended periods.
  • To ensure proper soldering, follow the recommended soldering conditions and guidelines provided in the datasheet. Use a soldering iron with a temperature range of 250°C to 260°C, and apply a moderate amount of soldering flux. Avoid applying excessive heat or pressure, which can damage the device.
  • The maximum allowable voltage for the SML-H10PD2BT86 is 5.5V, as specified in the datasheet. Exceeding this voltage can cause permanent damage to the device. It's essential to ensure that the voltage supply to the device does not exceed this limit.
  • To prevent damage, store the SML-H10PD2BT86 in its original packaging or an equivalent anti-static container. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures during storage and transportation. Handle the device by the edges or the body, avoiding direct contact with the pins or leads.
  • The recommended PCB layout and design considerations for the SML-H10PD2BT86 include providing adequate clearance around the device, using a solid ground plane, and minimizing signal trace lengths and widths. Additionally, ensure that the PCB material and thickness meet the recommended specifications to prevent warping or bending during assembly.

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SML-H10PD2BT86 Overview

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