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SMLE12BC7TT86 - ROHM Semiconductor

Description: Mini-mold Chip LED

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SMLE12BC7TT86 - ROHM Semiconductor PCB footprint - LEDs Chip - LEDs Chip - SML-E1
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SMLE12BC7TT86 - ROHM Semiconductor  - 3D model - LEDs Chip - SML-E1
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SMLE12BC7TT86 Details

  • Manufacturer Part Number:

    SMLE12BC7TT86

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    1.60 X 0.80 MM, 0.36 MM HEIGHT, ROHS COMPLIANT, 0603, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.40.20.00

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Color:

    BLUE

  • Color@Wavelength:

    Blue

  • Configuration:

    SINGLE

  • Forward Current-Max:

    0.02 A

  • JESD-609 Code:

    e4

  • Lens Type:

    COLORLESS TRANSPARENT

  • Luminous Intensity-Nom:

    22.0 mcd

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Optoelectronic Device Type:

    SINGLE COLOR LED

  • Overall Height:

    0.36 mm

  • Packing Method:

    TR, 7 INCH

  • Peak Wavelength:

    468 nm

  • Reverse Voltage-Max:

    5 V

  • Shape:

    RECTANGULAR

  • Size:

    1.2 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Gold (Au) - with Nickel (Ni) barrier

  • Terminal Pitch:

    1.65 mm

SMLE12BC7TT86 Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended temperature range (Ta = -40°C to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Monitor the device's junction temperature (Tj) to prevent overheating.
  • The maximum allowable voltage for the input pins is 6.5V. Exceeding this voltage may cause damage to the device.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input lines to protect the device from electrostatic discharge. Follow proper handling and storage procedures to prevent ESD damage.
  • Power up the device in the following sequence: VCC, then VIN. Ensure that VCC is stable before applying VIN. A soft-start circuit can be used to control the power-up sequence.

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SMLE12BC7TT86 Overview

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