ROHM recommends a thermal pad size of at least 2.5mm x 2.5mm, with multiple vias to the ground plane to ensure efficient heat dissipation. A thermal resistance of 10°C/W or less is recommended.
ROHM recommends derating the device's power dissipation according to the ambient temperature. For example, at 125°C, the maximum power dissipation should be limited to 50% of the rated value. Additionally, ensure proper thermal design and heat sinking to maintain a safe junction temperature.
ROHM recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, depending on the specific application requirements. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ensure stable operation.
Verify that the EN pin is properly connected to a logic-level signal (e.g., 3.3V or 5V) and that the signal is not floating. Ensure that the EN pin is not driven by an open-drain or open-collector output, as this can cause issues with the device's operation.
The maximum allowed voltage on the VOUT pin is 6.5V, which is the absolute maximum rating. However, for reliable operation, it is recommended to keep the output voltage within the specified range of 0.8V to 5.5V.
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