Part Image

SMLEN3WBC8W1 - ROHM Semiconductor

Description: Standard LEDs - SMD White 10mA; 120mcd 0603; 10mA; 33mW Pd

Download SMLEN3WBC8W1 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
SMLEN3WBC8W1 - ROHM Semiconductor PCB footprint - LEDs Chip - LEDs Chip - 1608 (0603) (1)1
click to zoom
3D Models
SMLEN3WBC8W1 - ROHM Semiconductor  - 3D model - LEDs Chip - 1608 (0603) (1)1
click to zoom

SMLEN3WBC8W1 Details

  • Manufacturer Part Number:

    SMLEN3WBC8W1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Japan, Mainland China, Malaysia

  • HTS Code:

    8541.40.20.00

  • Factory Lead Time:

    10 Weeks

  • Date Of Intro:

    2018-11-20

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Color:

    ULTRA HIGH BRIGHTNESS WHITE

  • Configuration:

    SINGLE

  • Forward Current-Max:

    0.01 A

  • Forward Voltage-Max:

    3.3 V

  • JESD-609 Code:

    e4

  • Lens Type:

    MILKY WHITE

  • Luminous Intensity-Min:

    0.056 cd

  • Luminous Intensity-Nom:

    120.0 mcd

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    SINGLE COLOR LED

  • Overall Height:

    0.36 mm

  • Packing Method:

    TR, 7 INCH

  • Reverse Voltage-Max:

    5 V

  • Shape:

    RECTANGULAR

  • Size:

    1.2 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Gold (Au) - with Nickel (Ni) barrier

  • Terminal Pitch:

    1.2 mm

SMLEN3WBC8W1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the SMLEN3WBC8W1 should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour connectivity to dissipate heat efficiently. Avoid routing high-current traces near the device to minimize thermal resistance.
  • To ensure reliable operation, follow the recommended operating conditions and derating guidelines in the datasheet. Implement proper thermal management, and consider using thermal protection circuits or thermistors to monitor temperature. Additionally, ensure that the device is properly soldered and that the PCB is designed to minimize thermal stress.
  • For EMI and EMC compliance, ensure that the PCB layout and component placement minimize radiation and susceptibility. Use shielding, filtering, and grounding techniques to reduce emissions. Follow the datasheet's recommended layout and decoupling guidelines, and consider using EMI filters or common-mode chokes to reduce noise.
  • Implement overvoltage protection using a voltage regulator or a TVS diode to prevent damage from voltage spikes. For overcurrent protection, use a current-sensing resistor and a comparator to detect excessive current. Consider using a dedicated overcurrent protection IC or a fuse to ensure reliable protection.
  • Handle the SMLEN3WBC8W1 with care to prevent damage from electrostatic discharge (ESD). Store the devices in their original packaging or in a conductive bag to prevent moisture and ESD damage. Follow the datasheet's recommended storage temperature and humidity guidelines, and avoid exposing the devices to direct sunlight or extreme temperatures.

Trust Checks

This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

SMLEN3WBC8W1 Overview

Use the download button to access the SMLEN3WBC8W1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SMLEN, or try a keyword search, such as Visible LEDs

Parts related to SMLEN3WBC8W1

Showing 0 results