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SMLJ18CA-TP - MCC

Description: 3000 Watt TVS 5.0 to 440 Volts

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PCB Footprints
SMLJ18CA-TP - MCC PCB footprint - Diodes Moulded Non Polarised - Diodes Moulded Non Polarised - SMC (DO-214AB)-1
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3D Models
SMLJ18CA-TP - MCC  - 3D model - Diodes Moulded Non Polarised - SMC (DO-214AB)-1
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SMLJ18CA-TP Details

  • Manufacturer Part Number:

    SMLJ18CA-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AB

  • Package Description:

    2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    8

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, PD-MIN

  • Breakdown Voltage-Max:

    22.1 V

  • Breakdown Voltage-Min:

    20 V

  • Breakdown Voltage-Nom:

    21.05 V

  • Clamping Voltage-Max:

    29.2 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    3000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    18 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

SMLJ18CA-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for SMLJ18CA-TP is a rectangular pad with a size of 2.5mm x 1.5mm, with a solder mask clearance of 0.1mm. It's also recommended to have a thermal pad underneath the component to improve heat dissipation.
  • While SMLJ18CA-TP has a high operating temperature range of -40°C to 150°C, it's not recommended to use it in extreme high-temperature environments (above 125°C) for extended periods. This may affect the component's reliability and lifespan.
  • To prevent ESD damage, it's recommended to handle SMLJ18CA-TP with an ESD wrist strap or mat, and to ensure that the workspace is ESD-protected. Avoid touching the component's pins or body, and use ESD-safe packaging and storage materials.
  • SMLJ18CA-TP is not hermetically sealed, so it's not recommended to use it in high-humidity environments (above 80% RH) without proper protection. Consider using a conformal coating or potting compound to protect the component from moisture.
  • The recommended soldering profile for SMLJ18CA-TP is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Avoid using excessive soldering temperatures or times, as this may damage the component.

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SMLJ18CA-TP Overview

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Part Image SMLJ18CAE3 Microsemi Corporation (now Microchip)

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For a full list of alternate parts for SMLJ18CA-TP, check out Findchips.com