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SMLJ26CA - Bourns

Description: Diode TVS Single Bi-Dir 26V 3KW 2-Pin SMC

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PCB Footprints
SMLJ26CA - Bourns PCB footprint - Diodes Moulded Non Polarised - Diodes Moulded Non Polarised - DIODE
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3D Models
SMLJ26CA - Bourns  - 3D model - Diodes Moulded Non Polarised - DIODE
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SMLJ26CA Details

  • Manufacturer Part Number:

    SMLJ26CA

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AB

  • Package Description:

    ROHS COMPLIANT, PLASTIC, SMC, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.6

  • Breakdown Voltage-Max:

    31.9 V

  • Breakdown Voltage-Min:

    28.9 V

  • Breakdown Voltage-Nom:

    30.4 V

  • Clamping Voltage-Max:

    42.1 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    3000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    5 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    26 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMLJ26CA Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SMLJ26CA is a rectangular pad with a size of 2.5 mm x 1.5 mm, with a 0.5 mm radius corner. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • To handle the high current rating of the SMLJ26CA, ensure that the PCB traces and vias are designed to handle the maximum current rating of the device. Use a sufficient trace width and via size to minimize resistance and heat generation. Additionally, consider using a thermal relief pattern to dissipate heat.
  • The recommended soldering profile for the SMLJ26CA is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to minimize oxidation.
  • To ensure the SMLJ26CA's reliability in high-temperature applications, ensure that the device is operated within its specified temperature range (-40°C to 150°C). Use a suitable thermal interface material (TIM) to improve heat transfer between the device and the heat sink. Additionally, consider using a heat sink with a high thermal conductivity to dissipate heat efficiently.
  • The SMLJ26CA is designed to withstand overvoltage conditions up to 26 V. During an overvoltage event, the device will clamp the voltage to its breakdown voltage (26 V) to protect the downstream circuitry. However, prolonged exposure to overvoltage conditions can reduce the device's lifespan.

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SMLJ26CA Overview

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Part Image SMC3K26CA-M3/9A Vishay Intertechnologies

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Part Image SMLJ26CE3 Microsemi Corporation (now Microchip)

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For a full list of alternate parts for SMLJ26CA, check out Findchips.com