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SMMBD330T1G - onsemi

Description: Extremely Low Minority Carrier Lifetime; Very Low Capacitance; Low Reverse Leakage; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Qualified and PPAP Capable

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PCB Footprints
SMMBD330T1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - BC847BW-1
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SMMBD330T1G - onsemi  - 3D model - SOT23 (3-Pin) - BC847BW-1
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SMMBD330T1G Details

  • Manufacturer Part Number:

    SMMBD330T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70 (SOT-323) 3 LEAD

  • Package Description:

    SC-70, SOT-323, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    419-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.1

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    30 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.6 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    1 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.12 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    0.2 µA

  • Reverse Test Voltage:

    25 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMMBD330T1G Frequently Asked Questions (FAQs)

  • A good PCB layout for SMMBD330T1G involves keeping the input and output traces short and separate, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure reliability in high-temperature applications, it's essential to follow the recommended operating temperature range, use a suitable thermal interface material, and provide adequate heat sinking. Additionally, consider derating the device's power handling capability at higher temperatures.
  • SMMBD330T1G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use ESD-safe materials, grounding straps, and ionizers to minimize the risk of ESD damage.
  • Yes, SMMBD330T1G can be used in switching regulator applications, but it's essential to ensure that the device is operated within its recommended frequency range and that the output is properly filtered to minimize ringing and overshoot.
  • To troubleshoot issues with SMMBD330T1G, start by checking the input voltage, output current, and PCB layout. Verify that the device is properly soldered and that there are no signs of physical damage. Use a thermal camera or thermometer to check for overheating, and consult the datasheet for guidance on troubleshooting specific issues.

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SMMBD330T1G Overview

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