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SMMBD770T1G - onsemi

Description: Extremely Low Minority Carrier Lifetime; Very Low Capacitance; Low Reverse Leakage; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Qualified and PPAP Capable

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Symbol
SMMBD770T1G - onsemi - PCB symbol
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PCB Footprints
SMMBD770T1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - BC847BW-1
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3D Models
SMMBD770T1G - onsemi - 3D model - SOT23 (3-Pin) - BC847BW-1
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SMMBD770T1G Details

  • Manufacturer Part Number:

    SMMBD770T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70 (SOT-323) 3 LEAD

  • Package Description:

    SC-70, SOT-323, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    419-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    onsemi

  • YTEOL:

    6.1

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    70 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    1 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.12 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    70 V

  • Reverse Current-Max:

    0.2 µA

  • Reverse Test Voltage:

    35 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMMBD770T1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2oz copper thickness and a thermal via array under the package is recommended. Refer to the onsemi application note AND9393/D for more details.
  • Ensure that the device is operated within the recommended operating temperature range (-40°C to 150°C). Use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K to improve heat transfer between the device and the heat sink. Also, ensure good airflow around the device.
  • The recommended soldering profile is a peak temperature of 260°C for 10-30 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s. Refer to the onsemi application note AND9394/D for more details.
  • Store the devices in their original packaging or in a dry, ESD-protected environment. Avoid exposing the devices to moisture, direct sunlight, or extreme temperatures. Handle the devices by the body, not the leads, to prevent damage.
  • Store the devices in a dry, ESD-protected environment with a relative humidity of 60% or less. Avoid exposing the devices to temperatures above 30°C or below -20°C. Handle the devices in accordance with the ESD Association standard, ANSI/ESD S20.20.

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SMMBD770T1G Overview

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