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SMMBFJ309LT1G - onsemi

Description: Drain and Source are interchangable; SOT-23 Surface Mount Package Saves Board Space; Low rDS(on) Provides Higher Efficiency and Extends Battery Life; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

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SMMBFJ309LT1G - onsemi - PCB symbol
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PCB Footprints
SMMBFJ309LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318 ISSUE AU
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3D Models
SMMBFJ309LT1G - onsemi - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318 ISSUE AU
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SMMBFJ309LT1G Details

  • Manufacturer Part Number:

    SMMBFJ309LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.82

  • FET Technology:

    JUNCTION

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Operating Temperature-Max:

    150 °C

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.225 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Time@Peak Reflow Temperature-Max (s):

    30

SMMBFJ309LT1G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SMMBFJ309LT1G is a standard SOT-23 package footprint with a minimum pad size of 0.8mm x 0.8mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure proper biasing, connect the base to a voltage divider network that sets the base voltage to around 0.7V to 1.0V, and ensure the collector-emitter voltage is within the recommended operating range of 10V to 30V.
  • The maximum power dissipation of the SMMBFJ309LT1G is 625mW, and it is recommended to derate the power dissipation to 500mW or less for reliable operation.
  • Yes, the SMMBFJ309LT1G can be used as a switch, but it is not recommended for high-frequency switching applications due to its relatively slow switching time. It is better suited for low-frequency switching or amplifier applications.
  • To protect the SMMBFJ309LT1G from ESD, handle the device with an anti-static wrist strap or mat, and ensure the PCB has adequate ESD protection circuits, such as TVS diodes or ESD protection arrays.

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SMMBFJ309LT1G Overview

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