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SMMBFJ310LT1G - onsemi

Description: Drain and Source are interchangable; SOT-23 Surface Mount Package Saves Board Space; Low rDS(on) Provides Higher Efficiency and Extends Battery Life; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

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SMMBFJ310LT1G - onsemi - PCB symbol
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PCB Footprints
SMMBFJ310LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318 ISSUE AU
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3D Models
SMMBFJ310LT1G - onsemi - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318 ISSUE AU
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SMMBFJ310LT1G Details

  • Manufacturer Part Number:

    SMMBFJ310LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.82

  • FET Technology:

    JUNCTION

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Operating Temperature-Max:

    150 °C

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.225 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Time@Peak Reflow Temperature-Max (s):

    30

SMMBFJ310LT1G Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the SMMBFJ310LT1G is -55°C to 150°C.
  • To ensure reliability, follow the recommended storage and handling procedures, and ensure that the device is operated within the recommended operating conditions. Additionally, consider using a radiation-hardened version of the device if it will be used in a high-radiation environment.
  • The maximum allowable power dissipation for the SMMBFJ310LT1G is 1.44 W at a junction temperature of 25°C.
  • The thermal resistance of the SMMBFJ310LT1G can be calculated using the thermal resistance values provided in the datasheet. The junction-to-ambient thermal resistance (RθJA) is 125°C/W, and the junction-to-case thermal resistance (RθJC) is 10°C/W.
  • The recommended soldering temperature profile for the SMMBFJ310LT1G is a peak temperature of 260°C, with a dwell time of 10-30 seconds.

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SMMBFJ310LT1G Overview

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