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SMMBT3904LT1G - onsemi

Description: These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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PCB Footprints
SMMBT3904LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT−23 (TO−236)
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3D Models
SMMBT3904LT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT−23 (TO−236)
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SMMBT3904LT1G Details

  • Manufacturer Part Number:

    SMMBT3904LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    318-08, TO-236, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.2 A

  • Collector-Emitter Voltage-Max:

    40 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    30

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.3 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    300 MHz

  • Turn-off Time-Max (toff):

    250 ns

  • Turn-on Time-Max (ton):

    70 ns

SMMBT3904LT1G Frequently Asked Questions (FAQs)

  • The maximum SOA for the SMMBT3904LT1G is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal and electrical characteristics. As a general guideline, the SOA is typically limited by the device's maximum junction temperature, current handling, and voltage ratings.
  • To ensure proper biasing, follow the recommended operating conditions and biasing schemes outlined in the datasheet. Additionally, consider the device's current gain, Early voltage, and output impedance when designing the bias circuit. It's also essential to ensure the device is operated within its recommended operating conditions to prevent overheating or damage.
  • Thermal management is crucial for the SMMBT3904LT1G, as excessive heat can reduce the device's lifespan and performance. Ensure good thermal conductivity between the device and the PCB, use thermal vias, and consider heat sinks or thermal interfaces if necessary. The device's thermal resistance (RθJA) is specified in the datasheet, which can help with thermal design calculations.
  • The SMMBT3904LT1G has built-in ESD protection, but it's still essential to follow proper handling and storage procedures to prevent ESD damage. Use anti-static wrist straps, mats, and packaging materials, and ensure the device is stored in a dry, ESD-safe environment. Additionally, consider adding external ESD protection devices or circuits in the system design if necessary.
  • The SMMBT3904LT1G's reliability and lifespan are influenced by factors such as operating conditions, temperature, and handling. The device is designed to meet the industry-standard reliability requirements, and its lifespan can be estimated based on the device's failure rate and operating conditions. Consult the datasheet and onsemi's reliability reports for more information.

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SMMBT3904LT1G Overview

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