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SMMBT4401LT1G - onsemi

Description: Miniature SOT-23 Surface Mount Package Saves Board Space; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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Symbol
SMMBT4401LT1G - onsemi - PCB symbol
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PCB Footprints
SMMBT4401LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT−23-11
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3D Models
SMMBT4401LT1G - onsemi - 3D model - SOT23 (3-Pin) - SOT−23-11
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SMMBT4401LT1G Details

  • Manufacturer Part Number:

    SMMBT4401LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.6 A

  • Collector-Emitter Voltage-Max:

    40 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    40

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.3 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    250 MHz

  • Turn-off Time-Max (toff):

    35 ns

  • Turn-on Time-Max (ton):

    255 ns

SMMBT4401LT1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package is recommended for optimal thermal performance. A copper pour on the PCB with multiple vias to a solid ground plane is also recommended to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended operating temperature range (-55°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling capability at high temperatures.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect against electrostatic discharge. Follow proper PCB layout and handling procedures to minimize ESD risks.
  • Optimize the device's operating conditions to minimize power losses. Use a low-loss PCB layout, minimize current density, and ensure good thermal conductivity. Consider using a heat sink or thermal interface material to reduce thermal resistance.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the leads or pins. Use anti-static packaging and follow proper ESD handling procedures.

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SMMBT4401LT1G Overview

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