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SMMBT5088LT1G - onsemi

Description: Miniature SOT-23 Surface Mount Package Saves Board Space; Low rDS(on) Provides Higher Efficiency and Extends Battery Life; Pb-Free Packages are Available; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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PCB Footprints
SMMBT5088LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AS
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3D Models
SMMBT5088LT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AS
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SMMBT5088LT1G Details

  • Manufacturer Part Number:

    SMMBT5088LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, TO-236, 318-08, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.05 A

  • Collector-Emitter Voltage-Max:

    30 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    300

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.3 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    50 MHz

SMMBT5088LT1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to an internal copper plane or a heat sink.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -55°C to 150°C. Implement a thermal management system, such as a heat sink or fan, to keep the junction temperature below 125°C. Monitor the device's thermal resistance (RθJA) and ensure it is within the specified range.
  • The SMMBT5088LT1G has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the SMMBT5088LT1G can be used in switching regulator applications. However, ensure that the device is operated within its recommended frequency range (up to 5 GHz) and that the switching frequency is not too high, as this can cause excessive power dissipation.
  • Minimize power losses by ensuring that the device is operated within its recommended operating conditions, including voltage, current, and temperature. Optimize the PCB layout to reduce parasitic inductance and resistance. Use a low-ESR capacitor for decoupling and ensure that the device is properly cooled.

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SMMBT5088LT1G Overview

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