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SMMBT5089LT1G - onsemi

Description: Miniature SOT-23 Surface Mount Package Saves Board Space; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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PCB Footprints
SMMBT5089LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT−23 (TO−236) 2.90x1.30x1.00 1.90P CASE 318 ISSUE AU_2024
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3D Models
SMMBT5089LT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT−23 (TO−236) 2.90x1.30x1.00 1.90P CASE 318 ISSUE AU_2024
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SMMBT5089LT1G Details

  • Manufacturer Part Number:

    SMMBT5089LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, TO-236, 318-08, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.05 A

  • Collector-Emitter Voltage-Max:

    25 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    400

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.3 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    50 MHz

SMMBT5089LT1G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SMMBT5089LT1G is a standard SOT-23 package with a 1.3mm x 1.3mm pad size and a 0.5mm x 0.5mm thermal pad.
  • To ensure the stability of the output voltage, it is recommended to use a minimum output capacitance of 1uF and a maximum ESR of 1 ohm, and to place the output capacitor as close to the output pin as possible.
  • The maximum input voltage that the SMMBT5089LT1G can handle is 18V, but it is recommended to operate the device within the recommended input voltage range of 3V to 15V for optimal performance.
  • The power dissipation of the SMMBT5089LT1G can be calculated using the formula: Pd = (Vin - Vout) x Iout, where Vin is the input voltage, Vout is the output voltage, and Iout is the output current.
  • The thermal resistance of the SMMBT5089LT1G is 240°C/W for the junction-to-ambient thermal resistance (RθJA) and 30°C/W for the junction-to-case thermal resistance (RθJC).

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SMMBT5089LT1G Overview

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