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SMMBTA56WT1G - onsemi

Description: Moisture Sensitivity Level: 1; ESD Rating: Human Body Model - 4 kV Machine Model - 400 V; Pb-Free Package is Available; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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Symbol
SMMBTA56WT1G - onsemi - PCB symbol
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PCB Footprints
SMMBTA56WT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC-70 (SOT-323) CASE419-04
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3D Models
SMMBTA56WT1G - onsemi - 3D model - SOT23 (3-Pin) - SC-70 (SOT-323) CASE419-04
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SMMBTA56WT1G Details

  • Manufacturer Part Number:

    SMMBTA56WT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70 (SOT-323) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    419-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Collector Current-Max (IC):

    0.5 A

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    100

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Operating Temperature-Max:

    150 °C

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    0.15 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transition Frequency-Nom (fT):

    50 MHz

SMMBTA56WT1G Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the SMMBTA56WT1G is -55°C to 150°C.
  • To ensure reliability, follow the recommended storage and handling procedures, and ensure that the device is operated within the recommended operating conditions. Additionally, consider using a radiation-hardened version of the device if it will be used in a radiation-rich environment.
  • The maximum allowable power dissipation for the SMMBTA56WT1G is 1.5 W at a case temperature of 25°C.
  • The thermal resistance of the SMMBTA56WT1G can be calculated using the thermal resistance values provided in the datasheet. The junction-to-case thermal resistance (RθJC) is 12.5°C/W, and the junction-to-ambient thermal resistance (RθJA) is 125°C/W.
  • The recommended soldering conditions for the SMMBTA56WT1G are a peak temperature of 260°C, with a dwell time of 10-30 seconds. The device should be soldered using a soldering iron with a temperature of 350°C.

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SMMBTA56WT1G Overview

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