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SMMBTH10-4LT3G - onsemi

Description: Miniature SOT-23 Surface Mount Package Saves Board Space; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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PCB Footprints
SMMBTH10-4LT3G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AS
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3D Models
SMMBTH10-4LT3G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AS
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SMMBTH10-4LT3G Details

  • Manufacturer Part Number:

    SMMBTH10-4LT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Collector-Base Capacitance-Max:

    0.7 pF

  • Collector-Emitter Voltage-Max:

    25 V

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • VCEsat-Max:

    0.5 V

SMMBTH10-4LT3G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a solid copper plane on the bottom layer of the PCB, directly underneath the device, and to use thermal vias to connect the top and bottom layers. This helps to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, provide adequate heat sinking, and consider derating the device's power handling capabilities. Additionally, ensure that the PCB and surrounding components are designed to withstand the high temperatures.
  • The recommended soldering conditions for the SMMBTH10-4LT3G are a peak temperature of 260°C, with a dwell time of 10-30 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device.
  • To handle ESD protection during handling and assembly, it's recommended to use an ESD wrist strap, mat, or workstation, and to follow proper handling and storage procedures. Additionally, ensure that the device is stored in its original packaging or an anti-static bag when not in use.
  • The recommended storage conditions for the SMMBTH10-4LT3G are a temperature range of -40°C to 125°C, with a relative humidity of 60% or less. It's essential to store the device in its original packaging or an anti-static bag to prevent damage.

Trust Checks

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SMMBTH10-4LT3G Overview

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