The recommended PCB footprint for SMMD805-SOD323 is a rectangular pad with a size of 0.95mm x 0.95mm, with a 0.2mm x 0.2mm thermal pad in the center. The pad should be solder-mask defined (SMD) with a non-solder-mask-defined (NSMD) thermal pad.
The thermal pad on the SMMD805-SOD323 should be connected to a solid copper plane on the PCB to ensure good thermal dissipation. A thermal via array can also be used to improve heat transfer to the other side of the PCB.
The maximum operating temperature for SMMD805-SOD323 is 150°C, with a storage temperature range of -40°C to 150°C.
To ensure reliable soldering of SMMD805-SOD323, use a soldering iron with a temperature of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. Apply a small amount of solder paste to the PCB pad and use a gentle soldering technique to avoid overheating the component.
The SMMD805-SOD323 has an ESD rating of 2kV human body model (HBM) and 250V machine model (MM).
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SMMD805-SOD323 Overview
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