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SMMJT350T1G - onsemi

Description: High Collector-Emitter Sustaining Voltage- VCEO(sus) = 300 Vdc @ IC = 1.0 mAdc; Excellent DC Current Gain - hFE = 30–240 @ IC = 50 mAdc; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

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PCB Footprints
SMMJT350T1G - onsemi PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT-223 -2020
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3D Models
SMMJT350T1G - onsemi  - 3D model - SOT223 (3-Pin) - SOT-223 -2020
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SMMJT350T1G Details

  • Manufacturer Part Number:

    SMMJT350T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223 (TO-261) 4 LEAD

  • Pin Count:

    4

  • Manufacturer Package Code:

    0.0318

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    0.5 A

  • Collector-Emitter Voltage-Max:

    300 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    20

  • JEDEC-95 Code:

    TO-261AA

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    2.75 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SMMJT350T1G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, using a minimum of 2 oz copper thickness, and ensuring a solid ground plane underneath the device. Additionally, it's recommended to use vias to connect the thermal pad to the ground plane to improve heat dissipation.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink or thermal interface material to improve heat dissipation, and ensure that the device is properly soldered to the PCB to minimize thermal resistance.
  • The SMMJT350T1G has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. This includes using an ESD wrist strap or mat, and ensuring that the device is properly grounded during handling.
  • Yes, the SMMJT350T1G is suitable for use in high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions, and to ensure that the device is properly qualified and validated for the specific application. Additionally, consider using a device with a higher temperature rating, such as the SMMJT350T2G, for more demanding applications.
  • To troubleshoot issues with the SMMJT350T1G, start by verifying that the device is properly soldered to the PCB, and that the recommended operating conditions are being met. Check for signs of overheating, such as excessive current draw or high temperatures. Use a oscilloscope or logic analyzer to verify that the device is receiving the correct input signals, and that the output signals are correct. If issues persist, consider consulting the onsemi support resources or contacting a technical support engineer.

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SMMJT350T1G Overview

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