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SMOMAPL138BGWTA3R - Texas Instruments

Description: Low-Power Applications Processor

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PCB Footprints
SMOMAPL138BGWTA3R - Texas Instruments PCB footprint - BGA - BGA - GWT (S-PBGA-N361)
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SMOMAPL138BGWTA3R - Texas Instruments  - 3D model - BGA - GWT (S-PBGA-N361)
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SMOMAPL138BGWTA3R Details

  • Manufacturer Part Number:

    SMOMAPL138BGWTA3R

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    361

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.75

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Address Bus Width:

    23

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    30 MHz

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B361

  • JESD-609 Code:

    e0

  • Length:

    16 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    64

  • Number of Terminals:

    361

  • On Chip Data RAM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA361,19X19,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    220

  • Qualification Status:

    Not Qualified

  • RAM (words):

    131072

  • Seated Height-Max:

    1.4 mm

  • Speed:

    456 MHz

  • Supply Current-Max:

    0.31 mA

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    16 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR, RISC

SMOMAPL138BGWTA3R Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. Ensure that the thermal pad is connected to a solid ground plane to dissipate heat efficiently.
  • Use a low-ESR capacitor (e.g., 10uF) close to the device's power pins to filter out noise and ensure stable operation. Additionally, use a 1uF capacitor in parallel with a 10uF capacitor to further reduce noise and ripple.
  • The recommended operating frequency range for the SMOMAPL138BGWTA3R is 100 kHz to 1 MHz. Operating outside this range may affect device performance and stability.
  • Use a shielded enclosure, ensure proper grounding, and follow good PCB layout practices to minimize electromagnetic interference (EMI). Additionally, use EMI filters or common-mode chokes to reduce emissions.
  • The maximum allowed junction temperature for the SMOMAPL138BGWTA3R is 150°C. Exceeding this temperature may affect device reliability and lifespan.

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SMOMAPL138BGWTA3R Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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