OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
Driver Number of Bits:
1
Input Characteristics:
STANDARD
Interface IC Type:
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code:
R-PDSO-G10
JESD-609 Code:
e4
Length:
3 mm
Moisture Sensitivity Level:
2
Number of Functions:
1
Number of Terminals:
10
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-55 °C
Output Current Flow Direction:
SINK
Output Current-Max:
0.5 A
Output Peak Current Limit-Nom:
1.3 A
Output Polarity:
TRUE
Package Body Material:
PLASTIC/EPOXY
Package Code:
HTSSOP
Package Equivalence Code:
TSSOP10,.19,20
Package Shape:
SQUARE
Package Style:
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Seated Height-Max:
1.1 mm
Supply Current-Max:
4 mA
Supply Voltage-Max:
36 V
Supply Voltage-Min:
3 V
Supply Voltage-Nom:
24 V
Surface Mount:
YES
Technology:
BIPOLAR
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.5 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
3 mm
SN6507DGQR Frequently Asked Questions (FAQs)
A good PCB layout for the SN6507DGQR involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
Proper thermal management involves providing adequate heat sinking, such as a thermal pad or a heat sink, and ensuring good airflow around the device. The thermal pad should be connected to a solid ground plane to dissipate heat efficiently.
The recommended input capacitor value is 10uF to 22uF, with an X5R or X7R dielectric type. The capacitor should be placed as close to the VIN pin as possible to minimize noise and ensure stable operation.
To troubleshoot issues with the SN6507DGQR, check the input voltage, output voltage, and current consumption. Verify that the input and output capacitors are properly connected and of the recommended value. Check for any signs of overheating, such as excessive temperature or thermal shutdown. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
The SN6507DGQR is rated for operation up to 125°C, making it suitable for high-temperature applications. However, for high-reliability applications, it's essential to follow proper design and manufacturing guidelines, such as using a robust PCB design, selecting high-reliability components, and ensuring adequate thermal management.
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SN6507DGQR Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
