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SN74AVC16834DGVR - Texas Instruments

Description: 18-Bit Universal Bus Driver With 3-State Outputs

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SN74AVC16834DGVR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGV (R-PDSO-G**)
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SN74AVC16834DGVR - Texas Instruments  - 3D model - Small Outline Packages - DGV (R-PDSO-G**)
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SN74AVC16834DGVR Details

  • Manufacturer Part Number:

    SN74AVC16834DGVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Pin Count:

    56

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    AVC

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e4

  • Length:

    11.3 mm

  • Load Capacitance (CL):

    30 pF

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    18

  • Number of Functions:

    18

  • Number of Ports:

    2

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP56,.25,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.04 mA

  • Prop. Delay@Nom-Sup:

    3.1 ns

  • Propagation Delay (tpd):

    7.8 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.4 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

SN74AVC16834DGVR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE03, which includes guidelines for signal routing, power supply decoupling, and thermal management to ensure optimal performance and minimize signal integrity issues.
  • The SN74AVC16834DGVR requires a specific power sequencing order to prevent damage or malfunction. The VCCA pin should be powered up before the VCCB pin, and the VCCB pin should be powered down before the VCCA pin. A power sequencing circuit or a power management IC can be used to ensure proper power sequencing.
  • The maximum operating frequency of the SN74AVC16834DGVR is 250 MHz, but it can be limited by the system's signal integrity, PCB layout, and clock signal quality. It's recommended to perform signal integrity analysis and simulation to ensure the device operates within its specified frequency range.
  • To ensure signal integrity and minimize jitter, it's recommended to use a low-skew clock signal, minimize the clock signal's rise and fall times, and use a high-quality PCB material with controlled impedance. Additionally, the use of signal termination resistors and capacitors can help to reduce signal reflections and ringing.
  • The SN74AVC16834DGVR has a maximum junction temperature of 150°C. To ensure reliable operation, it's recommended to use a heat sink or a thermal pad to dissipate heat, and to keep the device away from other heat sources. A thermal analysis or simulation can be performed to determine the optimal thermal management strategy.

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SN74AVC16834DGVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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